Multilayer PCB Circuit Board Blind Vias, Resin Hole Filling Process, Expedited Prototyping and Batch Processing at Lingdu Factory 1
SKU: fb6e834c9efc6d335a746e3351770b90 Многослойные печатные платы

Multilayer PCB Circuit Board Blind Vias, Resin Hole Filling Process, Expedited Prototyping and Batch Processing at Lingdu Factory

$0.12
✓ Цена производителя MOQ: 1

MOQ

1 шт

Срок поставки

N/A дней

Наличие

800 шт

Страна происхождения

CN

Бренд / Поставщик

Lingdu Electronic Technology (Gu'an) Co., Ltd

Характеристики товара

Unit pcs
Price Note 源数据为面议占位价(<10元),待人工核实真实出厂价
Trade Term EXW
Markup Rate 0.03
Incoterm Note EXW 出厂价(非 FOB).美元价 = 人民币出厂价 × 1.03 ÷ 6.7.
Price Cny Exw 0.824
Fx Rate Usd Cny 6.7
Price Cny Original 0.8
Price Is Placeholder 1
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Duty & Tax Estimate (US)

Landed Cost

$0.13

Duty

$0.00

VAT

$0.01

Est. Shipping

$0.00

L

Lingdu Electronic Technology (Gu'an) Co., Ltd

· 29 products

Integrity

100.00

Fulfillment

100.00

Type

factory

High Integrity Fast Fulfillment
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Описание товара

Multilayer PCB Circuit Board Blind Vias, Resin Hole Filling Process, Expedited Prototyping and Batch Processing at Lingdu Factory. Specifications: Brand: Lingdu. Wholesale & OEM/ODM supported. Price varies by order quantity.

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