5 Photos
Laird BSR Series High-Efficiency Shielding, Eco-Friendly, Halogen-Free Module Packaging Absorbing Materials Die-Cutting and Processable
MOQ
1 unidades
Prazo de Entrega
N/A dias
Estoque
1000 unidades
Origem
CN
Marca / Fornecedor
Shenzhen Jinxincheng Technology Co., Ltd
Especificações do produto
| Unit | pcs |
| Price Note | 源数据为面议占位价(<10元),待人工核实真实出厂价 |
| Trade Term | EXW |
| Markup Rate | 0.03 |
| Incoterm Note | EXW 出厂价(非 FOB).美元价 = 人民币出厂价 × 1.03 ÷ 6.7. |
| Price Cny Exw | 2.575 |
| Fx Rate Usd Cny | 6.7 |
| Price Cny Original | 2.5 |
| Price Is Placeholder | 1 |
Landed Cost
$0.41
Duty
$0.00
VAT
$0.02
Est. Shipping
$0.01
Shenzhen Jinxincheng Technology Co., Ltd
Integrity
Fulfillment
100.00
Type
factory
Descrição do produto
1. Name: Laird LAIRD Wave-Absorbing Material BSR-1/SS6M 0.25MM Wave-Absorbing Material, High Magnetic Conductivity Halogen-Free Electromagnetic Noise Suppression Soft Magnetic Film. 2. Introduction 1. Provides electromagnetic noise absorption and suppression effects from low to high frequency bands. 2 . High magnetic permeability and excellent ability to absorb and suppress electromagnetic clutter. 3 . Ultra-thin is only 0.025MM, new product first launched 4. Using rubber as the adhesive, it has high electrical resistance characteristics. 5 . Good flexibility, easy to process into various shapes. 3. Conventional parameters 4. Uses and applications 1. Personal Brain and Peripheral Equipment 2. Mobile Phone 3. Digital Camera 4. C D - R/ W 、 D V D 5 . DC-DC converter peripheral equipment 6. DVD, Blu-ray disc, recorder 7. In-car electronic equipment (navigation equipment, audio equipment) 8. Non-contact IC card reader 9. Chip module packaging 5. Actual product photography Laird BSR-1/SS6M wave-absorbing materials Microwave-absorbing material processing Precision wave-absorbing material processing Spaceless processing of absorbing materials (greatly saves material costs) MBSR-1/SS6M 0.25*305*305 MM wave-absorbing material sheets Applications of wave-absorbing materials 6. Remarks Can be used for adhesive die-cutting and stamping For details, please consult Jinjingcheng Technology engineering staff.
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