Custom BGA chip aging test mount, BGA324 ball IC adapter test fixture, socket 1.0 pitch FPGA
MOQ
1 PCS
Lieferzeit
N/A Tage
Lagerbestand
0
Herkunft
CN
Marke / Lieferant
Shenzhen Hongyi Electronics Co., Ltd.
Produktspezifikationen
| Unit | pcs |
| Trade Term | EXW |
| Markup Rate | 0.03 |
| Incoterm Note | EXW 出厂价(非 FOB).美元价 = 人民币出厂价 × 1.03 ÷ 6.7. |
| Price Cny Exw | 1936.4 |
| Fx Rate Usd Cny | 6.7 |
| Price Cny Original | 1880 |
Landed Cost
$309.24
Duty
$0.00
VAT
$14.45
Est. Shipping
$5.78
Shenzhen Hongyi Electronics Co., Ltd.
Integrity
Fulfillment
100.00
Type
factory
Produktbeschreibung
Custom BGA chip aging test mount, BGA324 ball IC adapter test fixture, socket 1.0 pitch FPGA. Specifications: Brand: ANDK. Wholesale & OEM/ODM supported. Price varies by order quantity.
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